Study of AlGaN/GaN High‐Electron‐Mobility Transistors on Si Substrate with Thick Copper‐Metallized Interconnects for Ka‐Band Applications
نویسندگان
چکیده
Herein, the AlGaN/GaN high-electron-mobility transistors (HEMTs) on silicon substrates using thick copper-metallized interconnects with Pt diffusion barrier layer for Ka-band application are reported. High output power density of 6.6 W mm−1 power-added efficiency (PAE) 45.6% at 28 GHz is achieved 4 × 50 μm device in continuous-wave (CW) mode. No obvious change drain–source current (I DS) observed under 40 V high-voltage stress 100 h and shows good thermal stability when annealed 300 °C 30 min. It demonstrates that HEMTs substrate can enhance performance reliability future 5 G applications.
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ژورنال
عنوان ژورنال: Physica Status Solidi A-applications and Materials Science
سال: 2023
ISSN: ['1862-6300', '1862-6319']
DOI: https://doi.org/10.1002/pssa.202200536